AD9852ASQZ datasheet(8/52 Pages) AD

8 / 52 page

AD9852

Rev. E | Page 8 of 52

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Maximum Junction Temperature

150°C

4 V

Digital Inputs

−0.7 V to +VS

Digital Output Current

5 mA

Storage Temperature

−65°C to +150°C

Operating Temperature

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Maximum Clock Frequency (ASVZ)

300 MHz

Maximum Clock Frequency (ASTZ)

200 MHz

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The heat sink of the AD9852ASVZ 80-lead TQFP package must

be soldered to the PCB.

Table 3.

Thermal Characteristic

TQFP

LQFP

θJA (0 m/sec airflow)1, 2, 3

16.2°C/W

38°C/W

θJMA (1.0 m/sec airflow)2, 3, 4, 5

13.7°C/W

θJMA (2.5 m/sec airflow)2, 3, 4, 5

12.8°C/W

1, 2

0.3°C/W

θJC6, 7

2.0°C/W

1 Per JEDEC JESD51-2 (heat sink soldered to PCB).

2 2S2P JEDEC test board.

3 Values of

are provided for package comparison and PCB design

considerations.

4 Per JEDEC JESD51-6 (heat sink soldered to PCB).

5 Airflow increases heat dissipation, effectively reducing θJA. Furthermore, the

more metal that is directly in contact with the package leads from metal

traces through holes, ground, and power planes, the more θJA is reduced.

6 Per MIL-Std 883, Method 1012.1.

7 Values of

are provided for package comparison and PCB design

considerations when an external heat sink is required.

To determine the junction temperature on the application PCB

use the following equation:

TJ = Tcase + (ΨJT × PD)

where:

TJ is the junction temperature expressed in degrees Celsius.

Tcase is the case temperature expressed in degrees Celsius, as

measured by the user at the top center of the package.

= 0.3°C/W.

PD is the power dissipation (PD); see the Power Dissipation and

Thermal Considerations section for the method to calculate PD.

EXPLANATION OF TEST LEVELS

Table 4.

Test Level

Description

100% production tested.

III

Sample tested only.

Parameter is guaranteed by design and

characterization testing.

Parameter is a typical value only.

Devices are 100% production tested at 25°C and

guaranteed by design and characterization testing

for industrial operating temperature range.

ESD CAUTION

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