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STM32F756VG 数据表(PDF) 202 Page - STMicroelectronics |
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STM32F756VG 数据表(HTML) 202 Page - STMicroelectronics |
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202 / 228 page  Package information STM32F756xx 202/228 DocID027589 Rev 4 Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 84. TFBGA100, 8 × 8 × 0.8mm thin fine-pitch ball grid array package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 114. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.400 mm Dsm 0.470 mm typ (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm |
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