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STM32F756VG 数据表(PDF) 204 Page - STMicroelectronics |
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STM32F756VG 数据表(HTML) 204 Page - STMicroelectronics |
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204 / 228 page  Package information STM32F756xx 204/228 DocID027589 Rev 4 Figure 86. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package recommended footprint A2 - 0.380 - - 0.0150 - A3(2) - 0.025 - - 0.0010 - b(3) 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 4.504 4.539 4.574 0.1773 0.1787 0.1801 E 5.814 5.849 5.884 0.2289 0.2303 0.2317 e - 0.400 - - 0.0157 - e1 - 4.000 - - 0.1575 - e2 - 4.800 - - 0.1890 - F - 0.2695 - - 0.0106 - G - 0.5245 - - 0.0206 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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