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MCP8024 数据表(PDF) 35 Page - Microchip Technology |
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MCP8024 数据表(HTML) 35 Page - Microchip Technology |
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35 / 46 page ![]() 2013 Microchip Technology Inc. DS20005228A-page 35 MCP8024 Microchip Technology Drawing C04-047-002A Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Terminals Overall Height Terminal Width Overall Width Overall Length Terminal Length Exposed Pad Width Exposed Pad Length Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b D E2 D2 A3 e L E N 0.40 BSC 0.20 REF 0.30 0.15 0.80 0.00 0.20 5.00 BSC 0.40 3.70 BSC 3.70 BSC 0.85 0.02 5.00 BSC MILLIMETERS MIN NOM 40 0.50 0.25 0.90 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 40-Lead Plastic Quad Flat, No Lead Package (MP) - 5x5 mm Body [QFN] With 3.7x3.7 mm Exposed Pad |
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