MCP8024 datasheet(10/46 Pages) MICROCHIP

10 / 46 page

MCP8024

DS20005228A-page 10

 2013 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges (Notes 1)

Specified Temperature Range

-40

+150

°C

Operating Temperature Range

-40

+150

°C

Storage Temperature Range

-55

+150

°C

(Note 2)

Thermal Package Resistance

5mm x 5mm QFN-40

JA

JC

—

5.2

—

°C/W 4-Layer JC51-7 standard board,

natural convection

7mm x 7mm TQFP-48-EP

JA

JC

—

°C/W

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.

1000 hour cumulative maximum for OTP data retention (typical).

ESD, SUSCEPTIBILITY, SURGE, AND LATCH-UP TESTING

Parameter

Standard and Test Condition

Value

Input voltage surges

ISO 16750-2

28V for 1 minute,

45V for 0.5 seconds

ESD HBM with 1.5 k

 / 100 pF

ESD-STM5.1-2001

JESD22-A114E 2007

CEI/IEC 60749-26: 2006

AEC-Q100-002-Ref_D

+4 kV

ESD CDM (Charged Device Model, field-

induced method – replaces machine-model

method)

ESD-STM5.3.1-1999

+750 V all pins

Latch-up Susceptibility

AEC Q100-004, 150°C

>100 mA

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