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MCP8024 数据表(PDF) 17 Page - Microchip Technology |
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MCP8024 数据表(HTML) 17 Page - Microchip Technology |
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17 / 46 page ![]() 2013 Microchip Technology Inc. DS20005228A-page 17 MCP8024 3.15 LA, LB, LC Low-side N-channel MOSFET drive signal. Connect to the gate of the external MOSFETs. A low-impedance resistor may be used between these pins and the MOSFET gates to limit current and slew rate. 3.16 HA, HB, HC High-side N-channel MOSFET drive signal. Connect to the gate of the external MOSFETs. A low-impedance resistor may be used between these pins and the MOSFET gates to limit current and slew rate. 3.17 PHA, PHB, PHC Phase signals from motor. Provides high-side N- channel MOSFET driver reference and Back EMF sense input. The phase signals are also used with the bootstrap capacitors to provide high-side gate drive via the VBx inputs. 3.18 VBA, VBB, VBC High-side MOSFET driver bias. Connect these pins between the bootstrap charge pump diode cathode and bootstrap charge pump capacitor. The 12V LDO output is used to provide 12V at the diode anodes. The phase signals are connected to the other side of the bootstrap charge pump capacitors. 3.19 DE2 Open-drain communications node. The DE2 communications is a half-duplex 9600 baud, 8-bit, no parity communications link. The open-drain DE2 pin must be pulled high by an external pull-up resistor. 3.20 HV_IN1, HV_IN2, LV_OUT1,LV_OUT2 Unidirectional digital level translators. Translates digital input signal on the HV_INx pin to a low-level digital out- put signal on the LV_OUTx pin. The HV_INx pins have internal 30K pullups to VDD that are controlled by Configuration register 0 bit 6. The Configuration regis- ter 0 bit 6 is only sampled during CE = 0. The HV_IN1 pin has higher ESD protection than the HV_IN2 pin. The higher ESD protection makes the HV_IN1 pin bet- ter suited for connection to external switches. LV_OUT1 and LV_OUT2 are open-drain outputs. An external pull-up resistor to the low-voltage logic supply is required. |
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