MCP8024 datasheet(38/46 Pages) MICROCHIP

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MCP8024

DS20005228A-page 38

 2013 Microchip Technology Inc.

Microchip Technology Drawing C04-183A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Exposed Pad

(L1)

SECTION A-A

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

protrusions shall not exceed 0.25mm per side.

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes:

Foot Length

Lead Width

Lead Thickness

Molded Package Length

Molded Package Width

Overall Length

Overall Width

Foot Angle

Footprint

Standoff

Overall Height

Lead Pitch

Number of Leads

12°

11°

13°

0.75

0.60

0.45

12°

0.22

7.00 BSC

9.00 BSC

3.5°

1.00 REF

0.09

0.17

11°

0°

13°

0.27

0.16

7°

1.00

0.50 BSC

NOM

MILLIMETERS

0.05

0.95

Units

MIN

1.05

0.15

1.20

MAX

Chamfers at corners are optional; size may vary.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or

Exposed Pad Length

Exposed Pad Width

3.50 BSC

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