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MCP8024 数据表(PDF) 7 Page - Microchip Technology

部件名 MCP8024
功能描述  Internal Bandgap Reference
PDF  46 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

MCP8024 数据表(HTML) 7 Page - Microchip Technology

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 2013 Microchip Technology Inc.
DS20005228A-page 7
MCP8024
Feedback Voltage Line
Regulation
VFB/VFB) /
VDD|
0.1
0.5
%/V
VDD = 6V to 28V
Feedback Voltage Load
Regulation
VFB / VFB|—
0.1
0.5
%
IOUT = 5 mA to 150 mA
Feedback Input Bias Current
IFB
-100
+100
nA
Sink/Source
Switching Frequency
fSW
461
kHz
Duty Cycle Range
DCMAX
3—
96
%
PMOS Switch On Resistance
RDSON
—0.6
VDD = 13V, TJ=25°C
PMOS Switch Current Limit
IP(MAX)
—2.5
A
Ground Current – PWM Mode
IGND
1.5
2.5
mA
Switching
Quiescent Current – PFM
Mode
IQ
150
200
AIOUT = 0mA
Output Voltage Adjust Range
VOUT
2.0
5.0
V
Output Current
IOUT
150
——mA
5v
250
3v
Output Power
POUT
750
mW
P = IOUT * VOUT
Voltage Supervisor
Undervoltage Lockout Start
UVLOSTRT
—6.0
6.25
V
VDD rising
Undervoltage Lockout Stop
UVLOSTOP
5.1
5.5
V
VDD falling
Undervoltage Lockout
Hysteresis
UVLOHYS
0.35
0.5
0.65
V
Overvoltage Lockout All
Functions Disabled
OVLOSTOP
32.0
33.0
V
VDD rising
Overvoltage Lockout All
Functions Enabled
OVLOSTRT
29.0
30.0
V
VDD falling
Overvoltage Lockout
Hysteresis
OVLOHYS
1.0
2.0
3.0
V
Temperature Supervisor
Thermal Warning
Temperature (115°C)
TWARN
72
%
Rising temperature,
percentage of thermal
shutdown temperature “MIN”
Thermal Warning Hysteresis
TWARN
15
°C
Falling temperature
Thermal Shutdown
Temperature
TSD
160
170
°C
Rising temperature
Thermal Shutdown Hysteresis
TSD
25
°C
Falling temperature
MOTOR CONTROL UNIT
Output Drivers
PWMH/L Input Pull-Down
RPULLDN
32
47
62
kΩ
AC/DC CHARACTERISTICS (CONTINUED)
El
ectrical Specifications: Unless otherwise noted TJ = -40°C to +150°C.
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation may cause the device operating junction temperature to exceed the
maximum 160°C rating. Sustained junction temperatures above 150°C can impact the device reliability
and OTP data retention.
2:
1000 hour cumulative maximum for OTP data retention (typical).



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