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MCP8024 数据表(PDF) 13 Page - Microchip Technology |
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MCP8024 数据表(HTML) 13 Page - Microchip Technology |
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13 / 46 page ![]() 2013 Microchip Technology Inc. DS20005228A-page 13 MCP8024 Note: Unless otherwise indicated: TA = +25°C; Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant. FIGURE 2-13: 12V LDO Dynamic Loadstep - Falling Current. FIGURE 2-14: 12V LDO Output Voltage vs Rising Input Voltage. FIGURE 2-15: Quiescent Current vs Temperature. FIGURE 2-16: Trapezoidal Back EMF. FIGURE 2-17: PWM Deadtime. FIGURE 2-18: Buck Snubber Turn On. -40 -30 -20 -10 0 10 20 30 40 0 5 10 15 20 25 Time (ms) Vout (AC) Vin = 14V Vout = 12V Cin = Cout = 10 µF Iout = 20 mA to 1 mA Step 10.0 10.5 11.0 11.5 12.0 12.5 13.0 0 5 10 15 20 25 30 Vin (V) Vout = 12V Cin = Cout = 10 µF Iout = 20 mA Charge Pump Hysteresis 0 200 400 600 800 1000 1200 -45 -20 5 30 55 80 105 130 155 Temperature (°C) CE Low CE High 0.0 0.5 1.0 1.5 2.0 2.5 Time ( ms) PHA PHB PHC 0 102030405060 Time (µs) Dead Time Dead Time PWMxH PWMxL 0 4 8 12 16 20 0.10 0.12 0.14 0.16 0.18 0.20 Time (µs) Snubber No Snubber Switch ON |
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