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STM32F303VC 数据表(PDF) 116 Page - STMicroelectronics |
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STM32F303VC 数据表(HTML) 116 Page - STMicroelectronics |
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116 / 148 page  Electrical characteristics STM32F303xB STM32F303xC 116/148 DocID023353 Rev 13 Figure 34. ADC accuracy characteristics Figure 35. Typical connection diagram using the ADC 1. Refer to Table 68 for the values of RAIN. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 11. The 10 nF capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. |
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