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MPXM2102AS 数据表(PDF) 46 Page - Motorola, Inc |
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MPXM2102AS 数据表(HTML) 46 Page - Motorola, Inc |
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46 / 670 page ![]() MMA1200D 2–10 Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction –Z +Z Direction of Earth’s gravity field.* Side View Side View Side View –Z +Z ORDERING INFORMATION Device Temperature Range Case No. Package MMA1200D *40 to +85°C Case 475–01 SOIC–16 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self–align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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