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MPXM2102AS 数据表(PDF) 97 Page - Motorola, Inc |
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MPXM2102AS 数据表(HTML) 97 Page - Motorola, Inc |
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97 / 670 page  MMA3201D 2–61 Motorola Sensor Device Data www.motorola.com/semiconductors Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self–align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. Figure 6. Footprint SOIC–20 (Case 475A–01) 0.380 in. 9.65 mm 0.050 in. 1.27 mm 0.024 in. 0.610 mm 0.080 in. 2.03 mm Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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