MPXM2102AS datasheet(89/670 Pages) MOTOROLA

89 / 670 page

MMA2202D

2–53

Motorola Sensor Device Data

www.motorola.com/semiconductors

* When positioned as shown, the Earth’s gravity will result in a positive 1g output

Positive Acceleration Sensing Direction

16–Pin SOIC Package

N/C pins are recommended to be left FLOATING

–X

10 11 12 13 14 15 16

8 7654321

Direction of Earth’s gravity field.*

Front View

Top View

Side View

ORDERING INFORMATION

Device

Temperature Range

Case No.

Package

MMA2202D

*40 to +85°C

Case 475–01

SOIC–16

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

footprint, the packages will self–align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and short-

ing between solder pads.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

MPXM2102AS 数据表(PDF) 89 Page - Motorola, Inc

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