MPXM2102AS datasheet(16/670 Pages) MOTOROLA

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Motorola Sensor Device Data

www.motorola.com/semiconductors

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to mini-

mize the thermal stress to which the devices are subjected.

• Always preheat the device.

• The delta temperature between the preheat and soldering

should be 100

°C or less.*

• For pressure sensor devices, a no–clean solder is

recommended unless the silicone die coat is sealed and

unexposed. Also, prolonged exposure to fumes can

damage the silicone die coat of the device during the solder

reflow process.

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method, the

difference should be a maximum of 10

°C.

• The soldering temperature and time should not exceed

260

°C for more than 10 seconds.

• When shifting from preheating to soldering, the maximum

temperature gradient shall be 5

°C or less.

• After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes. Gradual

cooling should be used since the use of forced cooling will

increase the temperature gradient and will result in latent

failure due to mechanical stress.

• Mechanical stress or shock should not be applied during

cooling.

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones and a figure

for belt speed. Taken together, these control settings make

up a heating “profile” for that particular circuit board. On

machines controlled by a computer, the computer remem-

bers these profiles from one operating session to the next.

Figure 3 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems, but it is a

good starting point. Factors that can affect the profile include

the type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177 –189

°C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

“RAMP”

STEP 2

VENT

“SOAK”

STEP 3

HEATING

ZONES 2 & 5

“RAMP”

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

STEP 6

VENT

STEP 7

COOLING

200

°C

150

°C

100

°C

TIME (3 TO 7 MINUTES TOTAL)

TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205

° TO 219°C

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100

°C

150

°C

160

°C

170

°C

140

°C

Figure 3. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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