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MPXM2102AS 数据表(PDF) 13 Page - Motorola, Inc |
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MPXM2102AS 数据表(HTML) 13 Page - Motorola, Inc |
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13 / 670 page  1–7 Motorola Sensor Device Data www.motorola.com/semiconductors To insure that silicon pressure sensors are designed and manufactured for reliability, an in-depth insight into what mechanisms cause particular failures is required. It is safe to say that unless a manufacturer has a clear understanding of everything that can go wrong with the device, it cannot design a device for the highest reliability. Figure 2 provides a look into the sensor operating concerns for a variety of potential usage applications. This information is utilized when developing the Failure Mode and Effects Analysis (FMEA). The FMEA then serves as the documentation that demonstrates all design and process concerns have been addressed to offer the most reliable approach. By under- standing how to design products, control processes, and eliminate the concerns raised, a reliable product is achieved. ACCELERATED LIFE TESTING It is very difficult to assess the reliability statistics for a product when very few or no failures occur. With cost as a predominant factor in any industrial setting and time of the utmost importance, the reliability test must be optimized. Optimization of reliability testing will allow the maximum amount of information on the product being tested to be gained in a minimum amount of time, this is accomplished by using accelerated life testing techniques. A key underlying assumption in the usage of accelerated life testing to estimate the life of a product at a lower or nominal stress is that the failure mechanism encountered at the high stress is the same as that encountered at the nominal stress. The most frequently applied accelerated environmental stress for semiconductors is temperature, it will be briefly explained here for its utilization in deter- mining the lifetime reliability statistics for silicon pressure sensors. PACKAGE: Integrity Plating Quality Dimensions Thermal Resistance Mechanical Resistance Pressure Resistance Media Compatibility GEL: Viscosity Thermal Coefficient of Expansion Permeability (Diffusion x Solubility) Changes in Material or Process Height Coverage Uniformity Adhesive Properties Media Compatibility Gel Aeration Compressibility DIE METALLIZATION: Lifting or Peeling Alignment Scratches Voids Laser Trimming Thickness Step Coverage Contact Resistance Integrity BONDING WIRES: Strength Placement Height and Loop Size Material Bimetallic Contamination (Kirkendall Voids) Nicking and other damage General Quality & Workmanship DIAPHRAGM: Size Thickness Uniformity Pits Alignment Fracture PASSIVATION: Thickness Mechanical Defects Integrity Uniformity LEADS: Materials and Finish Plating Integrity Solderability General Quality Strength Contamination Corrosion Adhesion ELECTRICAL PERFORMANCE: Continuity and Shorts Parametric Stability Parametric Performance Temperature Performance Temperature Stability Long Term Reliability Storage Degradation Susceptibility to Radiation Damage Design Quality DIE ATTACH: Uniformity Resistance to Mechanical Stress Resistance to Temperature Stress Wetting Adhesive Strength Cohesive Strength Process Controls Die Orientation Die Height Change in Material or Process Media Compatibility Compressibility DESIGN CHANGES MATERIAL OR PROCESS CHANGES FAB & ASSEMBLY CLEANLINESS SURFACE CONTAMINATION FOREIGN MATERIAL SCRIBE DEFECTS DIFFUSION DEFECTS OXIDE DEFECTS Figure 2. Process and Product Variability Concerns During Reliability Testing MARKING: Permanency Clarity SENSOR RELIABILITY CONCERNS Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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