MPXM2102AS datasheet(12/670 Pages) MOTOROLA

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Motorola Sensor Device Data

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Typical Test Conditions: Temperature per specified

storage maximum and minimum, no bias, test time = up to

1000 hours.

Potential Failure Modes: Parametric shift in offset and/or

sensitivity.

Potential Failure Mechanisms: Bulk die or diffusion

defects, mechanical creep in packaging components due to

thermal mismatch.

TEMPERATURE CYCLING (TC)

This is an environmental test in which the pressure sensor

is alternatively subjected to hot and cold temperature

extremes with a short stabilization time at each temperature

in an air medium. The test will stress the devices by

generating thermal mismatches between materials.

Typical Test Conditions: Temperature per specified

storage maximum and minimum (i.e., –40 to +125

°C for

automotive applications). Dwell time

≥ 15 minutes, transfer

time

≤ 5 minutes, no bias. Test time up to 1000 cycles.

Potential Failure Modes: Open, parametric shift in offset

and/or sensitivity.

Potential Failure Mechanisms: Wire bond fatigue, die

bond fatigue, port adhesive failure, volumetric gel changes

resulting in excessive package stress. Mechanical creep of

packaging material.

MECHANICAL SHOCK

This is an environmental test where the sensor device is

evaluated to determine its ability to withstand a sudden

change in mechanical stress due to an abrupt change in

motion. This test simulates motion that may be seen in

handling, shipping or actual use. MIL STD 750, Method 2016

Reference.

Typical Test Conditions: Acceleration = 1500 g’s, orienta-

tion = X, Y, Z planes, time = 0.5 milliseconds, 5 blows.

Potential Failure Modes: Open, parametric shift in offset

and/or sensitivity.

Potential Failure Mechanisms: Diaphragm fracture,

mechanical failure of wire bonds or package.

VARIABLE FREQUENCY VIBRATION

A test to examine the ability of the pressure sensor device

to withstand deterioration due to mechanical resonance. MIL

STD 750, Method 2056 Reference.

Typical Test Conditions: Frequency – 10 Hz to 2 kHz, 6.0

G’s max, orientation = X, Y, Z planes, 8 cycles each axis, 2

hrs. per cycle.

Potential Failure Modes: Open, parametric shift in offset

and/or sensitivity.

Potential Failure Mechanisms: Diaphragm fracture,

mechanical failure of wire bonds or package.

SOLDERABILITY

In this reliability test, the lead/terminals are evaluated for

their ability to solder after an extended time period of storage

(shelf life). MIL STD 750, Method 2026 Reference.

Typical Test Conditions: Steam aging = 8 hours, Flux= R,

Solder = Sn63, Pb37.

Potential Failure Modes: Pin holes, non–wetting,

dewetting.

Potential Failure Mechanisms: Poor plating, contamination.

OVER PRESSURE

This test is performed to measure the ability of the

pressure sensor to withstand excessive pressures that may

be encountered in the application. The test is performed from

either the front or back side depending on the application.

Typical Test Conditions: Pressure increase to failure,

record value.

Potential Failure Modes: Open.

Potential Failure Mechanisms: Diaphragm fracture,

adhesive or cohesive failure of die attach.

A pressure sensor may be placed in an application where

it will be exposed to various media that may chemically

attack the active circuitry, silicon, interconnections and/or

packaging material. The focus of media compatibility is to

understand the chemical impact with the other environmental

factors such as temperature and bias and determine the

impact on the device lifetime. The primary driving mecha-

nism to consider is permeation which quantifies the time for a

chemical to permeate across a membrane or encapsulant

corrosion can result.

Media related product testing is generally very specific to

the application since the factors that relate to the product

lifetime are very numerous and varied. An example is

solution pH where the further from neutral will drive the

chemical reaction, generally to a power rule relationship. The

pH alone does not always drive the reaction either, the

non–desired products in the media such as strong acids in

fuels as a result of acid rain can directly influence the lifetime.

It is recommended the customer and/or vendor perform

application specific testing that best represents the environ-

ment. This testing should be performed utilizing

in situ

monitoring of the critical device parameter to insure the

device survives while exposed to the chemical. The Sensor

Products Division within Motorola has a wide range of media

specific test capabilities and under certain circumstances will

perform application specific media testing.

A sufficient sample size manufactured over a pre-defined

time interval to maximize process and time variability is

tested based on the guidelines of the matrix shown above.

This test methodology is employed on all new product

introductions and process changes on current products.

A silicon pressure sensor has a typical usage environ-

ment of pressure, temperature, and voltage. Unlike the

typical bipolar transistor life tests which incorporate current

density and temperature to accelerate failures, a silicon

pressure sensor’s acceleration of its lifetime performance is

primarily based on the pressure and temperature interac-

tion with a presence of bias. This rationale was incorporated

into the development of the Pulsed Pressure Temperature

Cycling with Bias (PPTCB) test where the major accelera-

tion factor is the pressure and temperature component. It is

also why PPTCB is considered the standard sensor

operational life test.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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