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MPXM2102AS 数据表(PDF) 8 Page - Motorola, Inc |
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MPXM2102AS 数据表(HTML) 8 Page - Motorola, Inc |
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8 / 670 page  1–2 Motorola Sensor Device Data www.motorola.com/semiconductors Quality and Reliability — Overview A Major Objective of the Production Cycle From rigid incoming inspection of piece parts and materials, to stringent outgoing quality verification, the Motorola assembly and process flow is encompassed by an elaborate system of test and inspection stations; stations to ensure a step-by-step adherence to prescribed procedure. This produces the high level of quality for which Motorola is known . . . from start to finish. As illustrated in the process flow overview, every major manufacturing step is followed by an appropriate in-process quality inspection to insure product conformance to specification. In addition, Statistical Process Control (S.P.C.) techniques are utilized on all critical processes to insure processing equipment is capable of producing the product to the target specification while minimizing the variability. Quality control in wafer processing, assembly, and final test impart Motorola sensor products with a level of reliability that easily exceeds almost all industrial, consumer, and military requirements. Compensated Sensor Flow Chart LASER I.D. BINNING CHECK INITIAL OXIDATION P+ PHOTO RESIST P+ DIFFUSION RESISTOR PHOTO RESIST CAVITY PHOTO RESIST DIE SORT AND LOAD GEL FILL AND CURE RESISTOR IMPLANT THIN-FILM METAL DEP. WAFER FINAL VISUAL CELL MARKING 100% FUNCTIONAL TEST EMITTER PHOTO RESIST THIN-FILM METAL P.R. CLASS PROBE DIE BOND AND CURE FINAL VISUAL EMITTER DIFFUSION CONTACT PHOTO RESIST WAFER TO WAFER BOND WIREBOND PACK AND SHIP FINAL OXIDATION FRONT METAL 12 3 4 5 67 9 10 11 13 15 16 17 18 19 20 21 22 23 8 METAL PHOTO RESIST 12 CAVITY ETCH 14 SAW AND WASH LASER TRIM Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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