5802-DS02-R datasheet(34/50 Pages) BOARDCOM

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■ BCM5802

Production Specification

07/03/02

B roa dcom Co rpo rat ion

Page 26 Memory Structures

Document

5802-DS03-405-R

Table 13:

DSA Signing Command Context

MSB

LSB

31 30 29 28 27

26 25 24

23 22 21 20 19 18 17 16 15 14 13 12 11

10 9

Operation Type

DSA Signing (0x05)

Total Command Context Structure Length

Reserved

Message Hash Provided/Generated

Modulus p Length

Random Number k provided/RNG generated

Modulus q (160 bits, lowest word)

Modulus q (160 bits, 2nd lowest word)

……

Modulus q (160 bits, highest word)

Modulus p (512, 768, or 1024 bits, lowest word)

Modulus p (512, 768, or 1024 bits,2nd lowest word)

……

Modulus p (512, 768, or 1024 bits, highest word)

Base g (512, 768, or 1024 bits, lowest word of key)

Base g (512, 768, or 1024 bits, 2nd lowest word of key)

……

Base g (512, 768, or 1024 bits, highest word of key)

Private key y (512, 768, or 1024 bits, lowest word)

Private key y (512, 768, or 1024 bits, 2nd lowest word)

……

Private key y (512, 768, or 1024 bits, highest word)

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