| 数据搜索系统,热门电子元器件搜索 |
|
5802-DS02-R 数据表(PDF) 18 Page - Broadcom Corporation. |
|
|
|||||||||||||||||||||||||||||
5802-DS02-R 数据表(HTML) 18 Page - Broadcom Corporation. |
|
18 / 50 page ![]() ■ BCM5802 Production Specification 07/03/02 B roa dcom Co rpo rat ion Page 10 Hardware Signal Definition Table Document 5802-DS03-405-R AD[0] IO 80 PCI multiplexed address/data bus. PCI_CLK I 8 PCI clock, 25-33 MHz. GNT# I 17 PCI bus grant allowing the chip to use the bus. FRAME# IO 45 PCI frame, indicates the beginning and duration of a master transfer. IRDY# IO 46 PCI initiator ready. TRDY# IO 47 PCI target ready. DEVSEL# IO 49 PCI device select, asserted by an access target. STOP# IO 50 PCI stop, requesting that the current master stop an active transfer. PERR# IO 53 PCI parity error. SERR# IO 54 PCI system error, open drain. PAR IO 55 PCI parity. REQ# O 19 PCI bus request. RESET# I 16 PCI reset, tri-states all PCI outputs. INT# O 15 PCI interrupt output, open drain. IDSEL I 32 PCI Initialization Device Request, used for PCI configuration cycles. CBE#[3] IO 31 PCI command/byte enable, provides PCI bus command and data byte enables. CBE#[2] IO 43 PCI command/byte enable, provides PCI bus command and data byte enables. CBE#[1] IO 58 PCI command/byte enable, provides PCI bus command and data byte enables. CBE#[0] IO 70 PCI command/byte enable, provides PCI bus command and data byte enables. VCC I 51 Must be pulled up to VCC (PCI LOCK_). VCC Power pins, must be connected to a 3.3V source: 10, 18, 26, 40, 48, 57, 61, 74, 81, 90, 92, 93, 102, 103, 109, 110, 126, 127, 133, 134, 135, 143, 144. GND Ground pins: 5, 12, 14, 22, 30, 34, 44, 52, 56, 64, 69, 78, 84, 85, 89, 99, 100, 106, 107, 108, 116, 117, 118, 119, 122, 123, 136, 137, 139, 140. AVCC1 I 94 Analog VCC for 4x PLL. Connect to 3.3V. AGND1 I 98 Analog ground for 4x PLL. AVCC2 I 9 Analog VCC for deskew PLL. Connect to 3.3V. AGND2 I 7 Analog ground for deskew PLL. VIO I 111 PCI clamp voltage bias. Connect to 3.3V for 3.3V signaling environments. Connect to 5V for 5V signaling environments. EXPORT I 138 EXPORT pin (high = 56-bit encryption; low = strong encryption). Internally pulled up. TEST I 1 Test pin, internally pulled down, should be grounded for regular operation. When TEST is high, all outputs are tri-stated. TRST# I 131 Internally pulled up. Should be connected to ground for normal operation. Used for boundary scan JTAG testing. TMS I 120 Test mode select for JTAG boundary scan. Internally pulled up. Should be connected to VCC for normal operation. TCK I 6 Test mode clock for JTAG boundary scan. Internally pulled up. Unused in normal operation; connect to either high or low static level. Table 3: PCI Interface Pin Definitions Name I/O Pin # Description |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |