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STM32F405 数据表(PDF) 195 Page - STMicroelectronics

部件名 STM32F405
功能描述  Arm® Cortex®-M4 32b MCUFPU, 210DMIPS, up to 1MB Flash/1924KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera
PDF  204 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F405 数据表(HTML) 195 Page - STMicroelectronics

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DS8626 Rev 9
195/203
STM32F405xx, STM32F407xx
Revision history
31-May-2012
3
(continued)
Removed fHSE_ext typical value in Table 30: High-speed external user
clock characteristics. Updated Table 32: HSE 4-26 MHz oscillator
characteristics and Table 33: LSE oscillator characteristics (fLSE =
32.768 kHz).
Added fPLL48_OUT maximum value in Table 36: Main PLL
characteristics.
Modified equation 1 and 2 in Section 5.3.11: PLL spread spectrum
clock generation (SSCG) characteristics.
Updated Table 39: Flash memory characteristics, Table 40: Flash
memory programming, and Table 41: Flash memory programming with
VPP.
Updated Section : Output driving current.
Table 56: I2C characteristics: Note 4 updated and applied to th(SDA) in
Fast mode, and removed note 4 related to th(SDA) minimum value.
Updated Table 67: ADC characteristics. Updated note concerning ADC
accuracy vs. negative injection current below Table 68: ADC accuracy
at fADC = 30 MHz.
Added WLCSP90 thermal resistance in Table 98: Package thermal
characteristics.
Updated Table 90: WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch
wafer level chip scale package mechanical data.
Updated Figure 87: UFBGA176+25 ball, 10 x 10 mm, 0.65 mm pitch,
ultra fine pitch ball grid array package outline and Table 95:
UFBGA176+25 ball, 10 × 10 × 0.65 mm pitch, ultra thin fine pitch ball
grid array mechanical data.
Added Figure 91: LQFP176 - 176-pin, 24 x 24 mm low profile quad flat
recommended footprint.
Removed 256 and 768 Kbyte Flash memory density from Table : .
Table 99. Document revision history (continued)
Date
Revision
Changes



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