STM32F405 datasheet(200/204 Pages) STMICROELECTRONICS

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Revision history

STM32F405xx, STM32F407xx

200/203

DS8626 Rev 9

06-Mar-2015

Replace Cortex-M4F by Cortex-M4 with FPU throughout the

document.

Updated Section : Regulator OFF and Table 3: Regulator ON/OFF and

internal reset ON/OFF availability for LQFP176.

Updated Figure 15: STM32F40xxx LQFP176 pinout and Table 7:

STM32F40xxx pin and ball definitions.

Updated Figure 6: Multi-AHB matrix.

Added note 1 below Figure 12: STM32F40xxx LQFP64 pinout,

Figure 13: STM32F40xxx LQFP100 pinout, Figure 14: STM32F40xxx

LQFP144 pinout and Figure 15: STM32F40xxx LQFP176 pinout.

Updated IVDD and IVSS in Table 12: Current characteristics.

Updated PLS[2:0]=101 (falling edge) configuration in Table 19:

Embedded reset and power control block characteristics.

Added Section : Additional current consumption. Updated Section :

On-chip peripheral current consumption.

Updated Table 29: Low-power mode wakeup timings.

Updated Table 32: HSE 4-26 MHz oscillator characteristics and

Table 33: LSE oscillator characteristics (fLSE = 32.768 kHz).

Changed condition related to VESD(CDM) in Table 45: ESD absolute

maximum ratings.

Updated Table 47: I/O current injection susceptibility, Table 48: I/O

static characteristics, Table 49: Output voltage characteristics

conditions, Table 50: I/O AC characteristics and Figure 37: I/O AC

characteristics definition.

Updated Section : I2C interface characteristics.

Remove note 3 in Table 69: Temperature sensor characteristics.

Updated Figure 72: DCMI timing diagram.

Modified Figure 75: WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch

wafer level chip scale package outline and Table 90: WLCSP90 - 4.223

x 3.969 mm, 0.400 mm pitch wafer level chip scale package

mechanical data. Added Figure 76: WLCSP90 - 4.223 x 3.969 mm,

0.400 mm pitch wafer level chip scale recommended footprint and

Table 91: WLCSP90 recommended PCB design rules. /

Modified Figure 78: LQFP64 – 64-pin, 10 x 10 mm low-profile quad flat

package outline and Table 92: LQFP64 – 64-pin 10 x 10 mm low-profile

quad flat package mechanical data.

Updated Figure 87: UFBGA176+25 ball, 10 x 10 mm, 0.65 mm pitch,

ultra fine pitch ball grid array package outline and Table 95:

UFBGA176+25 ball, 10 × 10 × 0.65 mm pitch, ultra thin fine pitch ball

grid array mechanical data. Added Figure 88: UFBGA176+25 - 201-

ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball grid array

recommended footprint and Table 96: UFBGA176+2 recommended

PCB design rules (0.65 mm pitch BGA).

Updated Figure 90: LQFP176 - 176-pin, 24 x 24 mm low profile quad

flat package outline.

Added Section : Device marking for WLCSP90, Section : Device

marking for LQFP64, Section : Device marking for LFP100, Section :

Device marking for LQFP144, Section : Device marking for

UFBGA176+25 and Section : Device marking for LQFP176.

Table 99. Document revision history (continued)

Date

Revision

Changes

STM32F405 数据表(PDF) 200 Page - STMicroelectronics

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