L99LD21 datasheet(52/73 Pages) STMICROELECTRONICS

52 / 73 page

Electrical specifications

L99LD21

52/73

DS11130 Rev 5

6.2

ESD protection

6.3

Thermal characteristics

Table 32. ESD protection

Parameter

Value

Unit

All pins(1)

HBM (human body model, 100 pF, 1.5 k

Ω) according to MIL 883C, Method 3015.7 or EIA/JESD22A114-A.

±2

All output pins(2)

HBM with all none zapped pins grounded, output pins are VS, DIN, VLED1, VLED2.

±4

All pins (Charge Device Model)

±500

Corner pins (Charge Device Model)

±750

Table 33. QFN40L 6x6 thermal resistance

Symbol

Parameter

Min

Typ

Max

Unit

Rthj-amb

(1)

Device mounted on four layers 2s2p PCB (thermally enhanced, slug included).

Thermal resistance junction to ambient (JEDEC JESD 51-2)

—

°C/W

Rthj-board Thermal resistance junction to board (JEDEC JESD 51-8)

—

°C/W

Rthj-case Junction-to-case thermal resistance

—

7.2

—

°C/W

Table 34. Thermal characteristics

Symbol

Parameter

Min

Typ

Max

Unit

TJ_OP

Operating junction temperature

-40

150

°C

TW1

Junction temperature warning 1

120

130

140

°C

TW1_HYS

Temperature warning 1 hysteresis

°C

TW2

Junction temperature warning 2

130

140

150

°C

TW2_HYS

Temperature warning 2 hysteresis

°C

TTSD

Junction thermal shutdown

155

165

175

°C

TTSD_HYS

Junction thermal shutdown hysteresis

°C

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