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STM32L082KB 数据表(PDF) 112 Page - STMicroelectronics |
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STM32L082KB 数据表(HTML) 112 Page - STMicroelectronics |
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112 / 132 page  Package information STM32L082xx 112/132 DS10688 Rev 7 Figure 35. WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale recommended footprint Table 77. WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating - 0.025 - - 0.0010 - b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 3.259 3.294 3.329 0.1283 0.1297 0.1311 E 3.223 3.258 3.293 0.1269 0.1283 0.1296 e - 0.400 - - 0.0157 - e1 - 2.400 - - 0.0945 - e2 - 2.400 - - 0.0945 - F - 0.447 - - 0.0176 - G - 0.429 - - 0.0169 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 MS18965V2 Dsm Dpad |
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