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STM32L082KB 数据表(PDF) 113 Page - STMicroelectronics |
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STM32L082KB 数据表(HTML) 113 Page - STMicroelectronics |
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113 / 132 page ![]() DS10688 Rev 7 113/132 STM32L082xx Package information 126 Device marking for WLCSP49 The following figure gives an example of topside marking versus ball A 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 36. WLCSP49 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 78. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. MSv62458V1 L082CZ3 Y WW Product identification (1) Ball 1 indentifier Date code Revision code R |
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