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STM32L082KB 数据表(PDF) 114 Page - STMicroelectronics |
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STM32L082KB 数据表(HTML) 114 Page - STMicroelectronics |
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114 / 132 page  Package information STM32L082xx 114/132 DS10688 Rev 7 7.2 UFQFPN48 package information This UFQFPN is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package Figure 37. UFQFPN48 – Outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN48 package. It is recommended to connect and solder this back-side pad to PCB ground. A0B9_UFQFPN48_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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