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KSZ9567RTXI-TR 数据表(PDF) 224 Page - Microchip Technology |
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KSZ9567RTXI-TR 数据表(HTML) 224 Page - Microchip Technology |
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224 / 232 page ![]() KSZ9567R DS00002329D-page 224 2017-2019 Microchip Technology Inc. FIGURE 8-2: PACKAGE (DIMENSIONS) Microchip Technology Drawing C04-418B Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Footprint Exposed Pad Width Molded Package Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A2 e (L1) E N 0.40 BSC 9.85 0.13 - 0.05 0.18 1.00 REF 10.00 - - 16.00 BSC MILLIMETERS MIN NOM 128 10.15 0.23 1.20 0.15 MAX REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M 128-Lead Thin Quad Flatpack (6XX) - 14x14x1.0 mm Body [TQFP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: With 10x10 mm Exposed Pad Overall Length Exposed Pad Length D D2 9.85 16.00 BSC 10.00 10.15 DETAIL B e 2 X X= A OR B Terminal Length L 0.45 0.60 0.75 Molded Package Width E1 14.00 BSC Molded Package Length D1 14.00 BSC 0.95 1.00 1.05 - 0° 7° Footprint Angle Terminal Thickness c 0.09 - 0.20 |
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