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M58WR032EB 数据表(PDF) 53 Page - STMicroelectronics |
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M58WR032EB 数据表(HTML) 53 Page - STMicroelectronics |
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53 / 81 page ![]() 53/81 M58WR032ET, M58WR032EB PART NUMBERING Table 26. Ordering Information Scheme Table 27. Daisy Chain Ordering Scheme Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. Example: M58WR032ET 70 ZB 6 T Device Type M58 Architecture W = Multiple Bank, Burst Mode Operating Voltage R = VDD = 1.65V to 2.2V, VDDQ = 1.65V to 3.3V Device Function 032ET = 32 Mbit (x16), Top Boot 032EB = 32 Mbit (x16), Bottom Boot Speed 70 = 70 ns 80 = 80 ns 100 = 100 ns Package ZB = VFBGA56: 7.7x9 mm, 0.75 mm pitch Temperature Range 6 = –40 to 85°C Option T = Tape & Reel packing Example: M58WR032E -ZB T Device Type M58WR032E Daisy Chain ZB = VFBGA56: 7.7 x 9mm, 8x7 active ball array, 0.75 mm pitch Option T = Tape & Reel Packing |
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