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M58WR032EB 数据表(PDF) 1 Page - STMicroelectronics |
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M58WR032EB 数据表(HTML) 1 Page - STMicroelectronics |
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1 / 81 page ![]() 1/81 April 2004 M58WR032ET M58WR032EB 32 Mbit (2Mb x 16, Multiple Bank, Burst) 1.8V Supply Flash Memory FEATURES SUMMARY ■ SUPPLY VOLTAGE –VDD = 1.65V to 2.2V for Program, Erase and Read –VDDQ = 1.65V to 3.3V for I/O Buffers –VPP = 12V for fast Program (optional) ■ SYNCHRONOUS / ASYNCHRONOUS READ – Synchronous Burst Read mode: 54MHz – Asynchronous/ Synchronous Page Read mode – Random Access: 70, 80, 100ns ■ PROGRAMMING TIME – 8µs by Word typical for Fast Factory Program – Double/Quadruple Word Program option – Enhanced Factory Program options ■ MEMORY BLOCKS – Multiple Bank Memory Array: 4 Mbit Banks – Parameter Blocks (Top or Bottom location) ■ DUAL OPERATIONS – Program Erase in one Bank while Read in others – No delay between Read and Write operations ■ BLOCK LOCKING – All blocks locked at Power up – Any combination of blocks can be locked –WP for Block Lock-Down ■ SECURITY – 128 bit user programmable OTP cells – 64 bit unique device number – One parameter block permanently lockable ■ COMMON FLASH INTERFACE (CFI) ■ 100,000 PROGRAM/ERASE CYCLES per BLOCK Figure 1. Package ■ ELECTRONIC SIGNATURE – Manufacturer Code: 20h – Top Device Code, M58WR032ET: 8814h – Bottom Device Code, M58WR032EB: 8815h VFBGA56 (ZB) 7.7 x 9 mm FBGA |
类似零件编号 - M58WR032EB |
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类似说明 - M58WR032EB |
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