DSP56321RMSLASHD datasheet(26/88 Pages) NXP

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2-2

Thermal Characteristics

2.3 Thermal Characteristics

Table 2-1. Absolute Maximum Ratings

Rating1

Symbol

Value1, 2

Unit

Supply Voltage3

VCCQL

–0.1 to 2.25

Input/Output Supply Voltage3

VCCQH

–0.3 to 4.35

All input voltages

VIN

GND – 0.3 to VCCQH + 0.3

Current drain per pin excluding VCCQL, VCCQH,

and GND

I10

Operating temperature range5

0 to +85

°C

Storage temperature

TSTG

–55 to +150

°C

Notes:

GND = 0 V, VCCQL = 1.6 V ± 0.1 V, VCCQH = 3.3 V ± 0.3 V, TJ = 0°C to +85°C, CL = 50 pF

Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not

guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent

damage to the device.

Power-up sequence: During power-up, and throughout the DSP56321T operation, VCCQH voltage

must always be higher or equal to VCCQL voltage.

VCCQH provides input power for VCCA, VCCD, VCCC, VCCH, and VCCS. These power blocks are isolated

internally, but must be connected together externally.

Typically, this value implies a maximum ambient temperature (TA) of +70°C.

Table 2-2. Thermal Characteristics

Thermal Resistance Characteristic

Symbol

FC-PBGA

Value

Unit

Junction-to-ambient, natural convection, single-layer board (1s)1,2

RθJA

°C/W

Junction-to-ambient, natural convection, four-layer board (2s2p)1,3

RθJMA

°C/W

Junction-to-ambient, @200 ft/min air flow, single-layer board (1s)1,3

RθJMA

°C/W

Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)1,3

RθJMA

°C/W

Junction-to-board4

RθJB

°C/W

Junction-to-case thermal resistance5

RθJC

0.1

°C/W

Notes:

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting

site (board) temperature, ambient temperature, air flow, power dissipation of other components on the

board, and board thermal resistance. All values in this table are simulated; testing is not complete.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board

temperature is measured on the top surface of the board near the package.

Indicates the average thermal resistance between the die and the case top surface as measured by the

cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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