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MPC8560CPXAPDB 数据表(PDF) 72 Page - Freescale Semiconductor, Inc |
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MPC8560CPXAPDB 数据表(HTML) 72 Page - Freescale Semiconductor, Inc |
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72 / 108 page  MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1 72 Freescale Semiconductor Package and Pin Listings 14 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. 14.1 Package Parameters for the MPC8560 FC-PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 flip chip plastic ball grid array (FC-PBGA). Die size 12.2 mm × 9.5 mm Package outline 29 mm × 29 mm Interconnects 783 Pitch 1 mm Minimum module height 3.07 mm Maximum module height 3.75 mm Solder Balls 62 Sn/36 Pb/2 Ag Ball diameter (typical) 0.5 mm 14.2 Mechanical Dimensions of the MPC8560 FC-PBGA Figure 50 the mechanical dimensions and bottom surface nomenclature of the MPC8560, 783 FC-PBGA package. |
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