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MPC8560CPXAPDB 数据表(PDF) 91 Page - Freescale Semiconductor, Inc |
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MPC8560CPXAPDB 数据表(HTML) 91 Page - Freescale Semiconductor, Inc |
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91 / 108 page  MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1 Freescale Semiconductor 91 Thermal Figure 54. Thermal Performance of Select Thermal Interface Materials The system board designer can choose between several types of thermal interface. There are several commercially-available thermal interfaces provided by the following vendors: Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01888-4014 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc. 888-642-7674 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com The Bergquist Company 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com 0 0.5 1 1.5 2 0 10 203040 506070 80 Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) |
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