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S12SCIV2/D 数据表(PDF) 94 Page - Freescale Semiconductor, Inc

部件名 S12SCIV2/D
功能描述  Device User Guide V01.18
PDF  130 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

S12SCIV2/D 数据表(HTML) 94 Page - Freescale Semiconductor, Inc

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MC9S12H256 Device User Guide — V01.18
The total power dissipation can be calculated from:
PIO is the sum of all output currents on I/O ports associated with VDDX1,2 and VDDM1,2,3.
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Table A-5 Thermal Package Characteristics1
NOTES:
1. The values for thermal resistance are achieved by package simulations
Num C
Rating
Symbol
Min
Typ
Max
Unit
1T Thermal Resistance LQFP112, single sided PCB2
2. PC Board according to EIA/JEDEC Standard 51-2
θ
JA
––
54
oC/W
2T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes3
3. PC Board according to EIA/JEDEC Standard 51-7
θ
JA
––
41
oC/W
3
T Thermal Resistance LQFP 144, single sided PCB
θ
JA
––
45
oC/W
4T
Thermal Resistance LQFP 144, double sided PCB
with 2 internal planes
θ
JA
––
37
oC/W
T
J
T
A
P
D
Θ
JA
•
()
+
=
T
J
Junction Temperature, [
°C ]
=
T
A
Ambient Temperature, [
°C ]
=
P
D
Total Chip Power Dissipation, [W]
=
Θ
JA
Package Thermal Resistance, [
°C/W]
=
P
D
P
INT
P
IO
+
=
P
INT
Chip Internal Power Dissipation, [W]
=
P
INT
I
DDR
V
DDR
⋅
I
DDA
V
DDA
⋅
+
=
P
IO
R
DSON
i
∑
I
IO
i
2
⋅
=
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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