24CSM01 datasheet(40/63 Pages) MICROCHIP

40 / 63 page

24CSM01

DS20006781B

-page 40

Preliminary

 2023 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

SEATING

PLANE

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.85

0.40

0.22

–

0.00

–

0.60

–

MILLIMETERS

MIN

NOM

0.80

0.40

1.10

0.15

MAX

0.95 REF

Footprint

Overall Length

3.00 BSC

Terminal Thickness

0.08–0.23

–

0.07

–

Lead Bend Radius

–

0.07

–

Lead Bend Radius

–

0°

8°

Foot Angle

–

5°

15°

Mold Draft Angle

0.75

0.95

4.90 BSC

3.00 BSC

DETAIL B

4X 1

(L1)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed 0.15mm per side.

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Microchip Technology Drawing C04-111-MS Rev F

24CSM01 数据表(PDF) 40 Page - Microchip Technology

24CSM01 数据表(HTML) 40 Page - Microchip Technology

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