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24CSM01 数据表(PDF) 41 Page - Microchip Technology |
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24CSM01 数据表(HTML) 41 Page - Microchip Technology |
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41 / 63 page ![]() 2023 Microchip Technology Inc. and its subsidiaries Preliminary DS20006781B -page 41 24CSM01 RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS 0.65 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y X 1.45 0.45 NOM C Contact Pad Spacing 4.40 Contact Pad to Contact Pad (X4) G1 2.95 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: E C Contact Pad to Contact Pad (X6) GX 0.20 X Y G1 GX SILK SCREEN 8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP] Microchip Technology Drawing C04-2111-MS Rev F |
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