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PPC405EP 数据表(PDF) 36 Page - Applied Micro Circuits Corporation |
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PPC405EP 数据表(HTML) 36 Page - Applied Micro Circuits Corporation |
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36 / 50 page ![]() PPC405EP – PowerPC 405EP Embedded Processor 36 AMCC Revision 1.07 – September 10, 2007 Data Sheet Note: 1. For a chip mounted on a JEDEC 2S2P card without a heat sink. 2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist: a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption. VDD Logic voltage—1.8V. na na na Other pins Reserved Reserved pins. Do not make voltage, ground, or signal connections to these pins. na na na Table 7. Absolute Maximum Ratings The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device. None of the performance specification contained in this document are guaranteed when operating at these maximum ratings. Characteristic Symbol Value Unit Supply Voltage (Internal Logic) VDD 0 to +1.95 V Supply Voltage (I/O Interface) OVDD 0 to +3.6 V PLL Supply Voltage AVDD 0 to +1.95 V Input Voltage (1.8V CMOS receivers) VIN 0 to +1.95 V Input Voltage (3.3V LVTTL receivers) VIN 0 to +3.6 V Input Voltage (5.0V LVTTL receivers) VIN 0 to +5.5 V Storage Temperature Range TSTG -55 to +150 °C Case temperature under bias TC -40 to +120 °C Note: All specified voltages are with respect to GND. Table 8. Package Thermal Specifications The PPC405EP is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values for the E- PBGA packages in a convection environment are as follows: Package—Thermal Resistance Symbol Airflow ft/min (m/sec) Unit 0 (0) 100 (0.51) 200 (1.02) 31mm, 385-balls—Junction-to-Case θ JC 22 2 °C/W 31mm, 385-balls—Case-to-Ambient1 θ CA 17.8 16.8 16.1 °C/W Table 6. Signal Functional Description (Sheet 6 of 6) Secondary multiplexed signals are shown in brackets. Notes: 1. Receiver input has hysteresis. 2. Must pull up. See “Pull-Up and Pull-Down Resistors” on page 29 for recommended termination values. 3. Must pull down. See “Pull-Up and Pull-Down Resistors” on page 29 for recommended termination values. 4. If not used, must pull up. 5. If not used, must pull down. 6. Strapping input during reset; pull up or pull down as required. 7. Pull-up may be required. See “External Bus Control Signals” on page 30. Signal Name Description I/O Type Notes |
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