PPC440EP datasheet(62/84 Pages) AMCC

62 / 84 page

AMCC Proprietary

440EP – PPC440EP Embedded Processor

Revision 1.26 – April 25, 2007

Data Sheet

Thermal Management

The following heat sinks were used in the above thermal analysis:

ALPHA W35-15W (35mm x 35mm x15mm)

ALPHA LPD35-15B (35mm x 35mm x15mm)

Table 12. DC Power Supply Current Loads

Parameter

Symbol

Typical

Maximum

Unit

Notes

VDD (1.5V) active operating current

IDD

1380

2200

OVDD (3.3V) active operating current

IODD

100

SVDD (2.5V) active operating current

ISDD

460

600

AVDD (1.5V) input current

IADD

3.2

SAVDD (1.5V) active operating current

ISADD

6.05

Notes:

1. See “Absolute Maximum Ratings” on page 59 for filter recommendations.

2. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors

including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature,

and the power supply voltages. Your specific application can produce significantly different results. VDD current and power are primarily

dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD current and power

are primarily dependent on the capacitive loading, frequency, and utilization of the external buses.

3. Typical current is estimated at 667MHz with VDD = +1.5V, OVDD = +3.3V, SVDD = +2.5V, and TC = +85°C, while running Linux and a test

application that exercises each core with representative traffic.

4. Maximum current is estimated at 667MHz with VDD = +1.6V, OVDD = +3.6V, SVDD = +2.7V, TC = +85°C, and a best-case process (which

drives worst-case power), while running Linux and a test application that exercises each core with representative traffic.

Table 13. Package Thermal Specifications

Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:

Parameter

Symbol

Package

Airflow

ft/min (m/sec)

Unit

Notes

0 (0)

100 (0.51)

200 (1.02)

Junction-to-ambient thermal resistance

without heat sink

E-PBGA

20.0

18.7

17.9

°C/W

Junction-to-ambient thermal resistance

with heat sink

E-PBGA

15.3

11.9

10.5

°C/W

Resistance Value

Junction-to-case thermal resistance

E-PBGA

8.3

°C/W

Junction-to-board thermal resistance

E-PBGA

14.3

°C/W

Notes:

1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.

2. TA = TC - P×θCA, where TA is ambient temperature and P is power consumption.

3. TCMax = TJMax - P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.

4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.

5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.

6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a

0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.

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