AD4056BCPZ-R2 datasheet(10/67 Pages) AD

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Data Sheet

AD4050/AD4056

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 10 of 67

Table 7. Absolute Maximum Ratings

Parameter

Rating

Analog Inputs

IN+, IN−, REF to GND

−0.3 V to VDD + 0.3 V

Supply Voltages

VDD, VIO to GND

−0.3 V to +3.96 V

CLDO to GND

−0.3 V to +2.1 V

Digital Inputs to GND

−0.3 V to VIO + 0.3 V

Digital Outputs to GND

−0.3 V to VIO + 0.3 V

Temperature

Storage

−55°C to +150°C

Operating TJ Range

−40°C to +125°C

Maximum Reflow (Package Body)

260°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

Table 8. Thermal Resistance

Package Type1

θJA2

θJC3

Unit

CP-14-7

73.9

52.3

°C/W

CB-16-26

49.6

0.6

°C/W

1 Test Condition 1: thermal impedance simulated values are based upon use of

2S2P JEDEC PCB.

2 θJA is the natural convection junction-to-ambient thermal resistance measured

in a one cubic foot sealed enclosure.

3 θJC is the junction-to-case thermal resistance.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for AD4050/AD4056

Table 9. AD4050/AD4056, 14-Lead LFCSP and 16-Ball WLCSP

ESD Model

Withstand Threshold (kV)

Class

HBM

FICDM

1.25

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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