PIC16F1507-ESLASHSS. datasheet(215/278 Pages) MICROCHIP

215 / 278 page

 2011-2015 Microchip Technology Inc.

DS40001586D-page 215

PIC16(L)F1507

TABLE 25-6:

THERMAL CHARACTERISTICS

TABLE 25-5:

MEMORY PROGRAMMING SPECIFICATIONS

Standard Operating Conditions (unless otherwise stated)

Param.

No.

Sym.

Characteristic

Min.

Typ†

Max.

Units

Conditions

Program Memory

Programming Specifications

D110

VIHH

Voltage on MCLR/VPP pin

8.0

—

9.0

(Note 2)

D112

VPBE

VDD for Bulk Erase

2.7

—

VDDMAX

D113

VPEW

VDD for Write or Row Erase

VDDMIN

—VDDMAX

D114

IPPPGM Current on MCLR/VPP during

Erase/Write

—1.0

—

D115

IDDPGM Current on VDD during

Erase/Write

—5.0

—

Program Flash Memory

D121

Cell Endurance

10K

—

E/W -40

C  TA  +85C

(Note 1)

D122

VPRW

VDD for Read/Write

VDDMIN

—VDDMAX

D123

TIW

Self-timed Write Cycle Time

—

2.5

D124

TRETD

Characteristic Retention

—

Year Provided no other

specifications are violated

D125

EHEFC

High-Endurance Flash Cell

100K

—

E/W 0

C  TA  +60°C, lower

byte last 128 addresses

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1:

Self-write and Block Erase.

Required only if single-supply programming is disabled.

Standard Operating Conditions (unless otherwise stated)

Param.

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance Junction to Ambient

62.2

C/W

20-pin DIP package

77.7

C/W

20-pin SOIC package

87.3

C/W

20-pin SSOP package

46.2

C/W

20-pin QFN 4x4mm package

32.8

C/W

20-pin UQFN 4x4mm package

TH02

JC

Thermal Resistance Junction to Case

27.5

C/W

20-pin DIP package

23.1

C/W

20-pin SOIC package

31.1

C/W

20-pin SSOP package

13.2

C/W

20-pin QFN 4x4mm package

27.4

C/W

20-pin UQFN 4x4mm package

TH03

TJMAX

Maximum Junction Temperature

150

C

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD(1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TJ - TA)/

JA(2)

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature; TJ = Junction Temperature

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