PIC16F1507-ESLASHSS. datasheet(276/278 Pages) MICROCHIP

276 / 278 page

PIC16(L)F1507

DS40001586D-page 276

 2011-2015 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

PART NO.

/XX

XXX

Pattern

Package

Temperature

Range

Device

Device:

PIC16LF1507, PIC16F1507

Tape and Reel

Option:

Blank = Standard packaging (tube or tray)

= Tape and Reel(1)

Temperature

Range:

I= -40

C to +85C(Industrial)

E= -40

C to +125C

(Extended)

Package:

Micro Lead Frame (4x4x0.5mm) (UQFN)

Micro Lead Frame (4x4x0.9mm) (QFN)

Plastic DIP

SOIC

SSOP

Pattern:

QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

PIC16LF1507T - I/SO

Tape and Reel,

Industrial temperature,

SOIC package

PIC16F1507 - I/P

Industrial temperature

PDIP package

PIC16F1507 - E/ML 298

Extended temperature,

QFN package

QTP pattern #298

Note 1:

Tape and Reel identifier only appears in the

catalog part number description. This

identifier is used for ordering purposes and is

not printed on the device package. Check

with your Microchip Sales Office for package

availability with the Tape and Reel option.

For other small form-factor package

availability and marking information, please

visit www.microchip.com/packaging or

contact your local sales office.

[X](1)

Tape and Reel

Option

PIC16F1507-E/SS. 数据表(PDF) 276 Page - Microchip Technology

PIC16F1507-E/SS. 数据表(HTML) 276 Page - Microchip Technology

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