PAC1932SLASH3SLASH4 datasheet(2/62 Pages) MICROCHIP

2 / 62 page

PAC1932/3/4

DS20005850C-page 2

 2017-2018 Microchip Technology Inc.

Package Types

Device Block Diagram

PAC1934 – Top View

2.225x2.17 mm WLCSP

SENSE1+

SENSE1-

SENSE2+

SENSE2-

SENSE3+

SENSE3-

SENSE4+

SENSE4-

GND

SM_DATA

SM_CLK

VDD

VDD I/O

ADDRSEL

PWRDN

SLOW/ALERT

PAC1932/3/4 – Top View

4x4x 0.5 mm UQFN*

*Includes Exposed Thermal Pad; see Table 3-1.

GND

SENSE1+

SENSE1-

SM_CLK

Exposed pad

VDD

SLOW/ALERT

SENSE4+

SENSE4-

VDD

GND

VDD I/O

ADDRS EL

SLO W/ALE RT

Accumlato r

Differen tia l

VSENS E

Amplifier

VBUS

Buffer/

Divi der

SM_CLK

SM_DATA

PWRDN

ADC/MUX Clocking &

Control

VBUS

Registe rs

VSENS E

Registe rs

VPOWE R

Registe rs

Accumulator

Registe rs

Control

Registe rs

Calculation

and

Calibra tion

16-bit

ADC

16-bit

ADC

Resistor

Decoder

SENSE 1+

SENSE 1-

SENSE 2+

SENSE 2-

SENSE 3+

SENSE 3-

SENSE 4+

SENSE 4-

VBUS1

VBUS2

High

Voltage

MUX

VBUS4

Sen se1+

Sen se2+

Sen se1-

Sen se2-

Sen se3+

Sen se3-

Sen se4+

Sen se4-

VBUS3

Note:

For PAC1932, channels 3 and 4 are inactive.

For PAC1933, channel 4 is inactive.

PAC1932/3/4 数据表(PDF) 2 Page - Microchip Technology

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