PAC1932SLASH3SLASH4 datasheet(54/62 Pages) MICROCHIP

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PAC1932/3/4

DS20005850C-page 54

 2017-2018 Microchip Technology Inc.

Microchip Technology Drawing C04-257A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Number of Pins

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.127 REF

2.50

0.30

0.25

0.45

0.00

0.30

4.00 BSC

0.40

2.60

0.50

0.02

4.00 BSC

MILLIMETERS

MIN

NOM

2.70

0.50

0.35

0.55

0.05

MAX

K-

0.20

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad

16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]

PAC1932/3/4 数据表(PDF) 54 Page - Microchip Technology

PAC1932/3/4 数据表(HTML) 54 Page - Microchip Technology

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