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STPCC0366BTC3 数据表(PDF) 45 Page - STMicroelectronics |
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STPCC0366BTC3 数据表(HTML) 45 Page - STMicroelectronics |
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45 / 51 page ![]() BOARD LAYOUT 45/51 Release B This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. When using DIMM modules, schematics have to be done carefully in order to avoid data busses completely crossed on the board. This has to be checked at the library level. In order to achive lay- out shown in Figure 6-12, schematics have to im- plement the crossing described on Figure 6-13. The DQM signals must be exchanged using the same order. Figure 6-11. Clock routing MCLKO DIMMCKn input STPCMCLKI DIMMCKn input DIMMCKn input Low skewclock driver: L L+75mm* 20pF * No additionnal 75mm when SDRAM directly soldered on board Figure 6-12. Optimum data bus layout for DIMM Figure 6-13. Schematics for optimum data bus layout for DIMM DIMM STPC SDRAMI/F D[15:00] D[31:16] D[47:32] D[63:48] MD[31:00] MD[63:32] MD[15:00],DQM[1:0] MD[31:16],DQM[3:2] MD[47:32],DQM[5:4] MD[63:48],DQM[7:6] D[15:00],DQM[1:0] D[31:16],DQM[3:2] D[47:32],DQM[5:4] D[63:48],DQM[7:6] DIMM STPC |
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