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STM8L151C4 数据表(PDF) 94 Page - STMicroelectronics |
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STM8L151C4 数据表(HTML) 94 Page - STMicroelectronics |
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94 / 101 page ![]() Package characteristics STM8L151xx, STM8L152xx 94/101 Doc ID 15962 Rev 2 9.2 Package mechanical data Figure 21. WFQFPN28 – 28-lead very very thin fine pitch quad flat no-lead package outline (4x4)(1) Figure 22. Recommended footprint (dimensions in mm)(1) 1. Drawing is not to scale. DG_ME b 15 21 22 28 1 7 D e b e E ddd ddd L1 14 L2 A1 A A3 Table 53. WFQFPN28 – 28-lead very very thin fine pitch quad flat no-lead package (4 x 4), package mechanical data(1) Dim. mm inches(2) Min Typ Max Min Typ Max A(1) 0.7 0.75 0.8 0.0276 0.0295 0.0315 A1 0 0.02 0.05 0 0.0008 0.002 A3 0.2 0.0079 b 0.18 0.25 0.3 0.0071 0.0098 0.0118 D 4 0.1575 E 4 0.1575 e 0.5 0.0197 L1 0.25 0.35 0.45 0.0098 0.0138 0.0177 L2 0.3 0.4 0.5 0.0118 0.0157 0.0197 ddd 0.08 0.0031 Number of pins N28 1. Thickness valid for the WFQFPN28 package in the sampling phase. In the production phase, the UFQFPN28 package will be used with a thickness equal to 0.6 mm. 2. Values in inches are converted from mm and rounded to 4 decimal digits. |
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