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STM8L151C4 数据表(PDF) 97 Page - STMicroelectronics |
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STM8L151C4 数据表(HTML) 97 Page - STMicroelectronics |
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97 / 101 page ![]() STM8L151xx, STM8L152xx Package characteristics Doc ID 15962 Rev 2 97/101 Figure 25. VFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline(1)(2) Figure 26. Recommended footprint (dimensions in mm)(1) 1. Drawing is not to scale. 2. The exposed pad must be soldered to the PCB. It is recommended to connect it to VSS. Seating plane A3 A1 A2 A D e e E2 b E L L D2 b V0_ME C 12 13 24 25 36 37 1 48 7.30 7.30 0.20 0.30 0.55 0.50 5.80 6.20 6.20 5.60 5.60 5.80 0.75 ai15697 48 1 12 13 24 25 36 37 Table 56. VFQFPN48 – very thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm pitch package mechanical data(1) Symbol millimeters inches(2) Typ Min Max Typ Min Max A(1) 0.900 0.800 1.000 0.0354 0.0315 0.0394 A1 0.020 0.050 0.0008 0.0020 A2 0.650 1.000 0.0256 0.0394 A3 0.250 0.0098 b 0.230 0.180 0.300 0.0091 0.0071 0.0118 D 7.000 6.850 7.150 0.2756 0.2697 0.2815 D2 4.700 2.250 5.250 0.1850 0.0886 0.2067 E 7.000 6.850 7.150 0.2756 0.2697 0.2815 E2 4.700 2.250 5.250 0.1850 0.0886 0.2067 e 0.500 0.450 0.550 0.0197 0.0177 0.0217 L 0.400 0.300 0.500 0.0157 0.0118 0.0197 ddd 0.080 0.0031 1. Thickness valid for the VFQFPN48 package in the sampling phase. In the production phase, the UFQFPN48 package will be used with a thickness equal to 0.6 mm. 2. Values in inches are converted from mm and rounded to 4 decimal digits. |
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