STM8L151C4 datasheet(95/101 Pages) STMICROELECTRONICS

部件名	STM8L151C4

功能描述	8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators

PDF	101 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

95 / 101 page

STM8L151xx, STM8L152xx

Package characteristics

Doc ID 15962 Rev 2

95/101

Figure 23.

WFQFPN32 – 32-lead very very thin fine pitch quad flat no-lead package

outline (5 x 5)

The exposed pad must be soldered to the PCB. It is recommended to connect it to VSS.

Seating plane

ddd

Pin # 1 ID

R = 0.30

A0A3_ME

Bottom view

Table 54.

WFQFPN32 – 32-lead very very thin fine pitch quad flat no-lead package (5 x 5),

package mechanical data(1)

Dim.

inches(2)

Min

Typ

Max

Min

Typ

Max

A(1)

0.70

0.75

0.80

0.0276

0.0295

0.0315

0.02

0.05

0.0008

0.0020

0.20

0.0079

0.18

0.25

0.30

0.0071

0.0098

0.0118

4.85

5.00

5.15

0.1909

0.1969

0.2028

3.20

3.45

3.70

0.1260

0.1358

0.1457

4.85

5.00

5.15

0.1909

0.1969

0.2028

3.20

3.45

3.70

0.1260

0.1358

0.1457

0.50

0.0197

0.30

0.40

0.50

0.0118

0.0157

0.0197

ddd

0.08

0.0031

Number of pins

N32

Thickness valid for the WFQFPN32 package in the sampling phase. In the production phase, the UFQFPN32 package will

be used with a thickness equal to 0.6 mm.

Values in inches are converted from mm and rounded to 4 decimal digits.

STM8L151C4 数据表(PDF) 95 Page - STMicroelectronics

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