MPC8536EBVTATH datasheet(125/128 Pages) FREESCALE

部件名	MPC8536EBVTATH

功能描述	PowerQUICC??III Integrated Processor Hardware Specifications

PDF	128 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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125 / 128 page

Mechanical Dimensions of the MPC8536E FC-PBGA

MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

125

5.2

Mechanical Dimensions of the MPC8536E FC-PBGA

The mechanical dimensions and bottom surface nomenclature of the MPC8536E, 783 FC-PBGA package are shown in

Figure 81.

Figure 81. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8536E FC-PBGA

NOTES for Figure 81

All dimensions are in millimeters.

Dimensions and tolerances per ASME Y14.5M-1994.

Maximum solder ball diameter measured parallel to datum A

Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

Capacitors may not be present on all devices

Caution must be taken not to short exposed metal capacitor pads on package top.

All dimensions are symmetric across the package center lines, unless dimensioned otherwise.

MPC8536EBVTATH 数据表(PDF) 125 Page - Freescale Semiconductor, Inc