CS49310 datasheet(89/90 Pages) CIRRUS

89 / 90 page

CS49300 Family DSP

DS339F7

15. DOCUMENT REVISIONS

Revision

Date

Changes

PP4

Mar 2003

Last preliminary release.

Feb 2004

Initial final release.

1. p.73, Corrected Hex Message ”B” Value 74 from:

0x0014C0 to 0x0028C0

2. p. 84, Added ROM ID-5 devices and a note on ordering lead-free devices to

“Ordering Information”. Also added a description of the characters that comprise

the part number.

3. Removed ambient temperature condition (TA=25°C) from Spec Tables.

4. Changed Note 6. in Table 1.9 (p.12) and Table 1.10 (p.14) from:

With a 4.7k Ohm pull-up resistor this value is typically 215ns. As this pin is open

drain adjusting the pull up value will affect the rise time.

With a 3.3k Ohm pull-up resistor this value is typically 260ns. As this pin is open

drain adjusting the pull up value will affect the rise time.

5. Added a section “2.1. - CS493XX Document Strategy” (p.21)

6. p.10, Changed CS to DS for Tmdd

7. p.10, Deleted the word “low” from the Parameter column for Tmdis

8. p. 84 Added two diagrams that indicate how to determine the “Device Revi-

sion Level” from the 10-character or the 12-character Pack Mark written on the

top of chip, below the device number.

9. p. 80, Made reference to the use of pin 4 & pin 5 as mode select pin at reset.

Also added that both these pins require 3.3 k Ohm pull-up or pull-down

10. p. 81, Changed pin 19 & pin 20 pull-up/down resistor requirement to 3.3 k

Ohm. Also mention of pin 19 usage as a mode select pin during reset.

Apr 2004

Changed “All bidirectional pins high-Z after RESET low” ( Trst2z) parameter from

50ns Max to 100ns Max. See page 8.

APR 2005

Updated Device Ordering Information to include Pb-free devices.

JUN 2005

Corrected error in mechanical information - “e”, pin spacing from .102 mm to

1.016 mm

NOV 2005

Updated CLKIN high/low times to 14 ns. Added “Delay from falling edge of

CMPREQ to CMPCLK rising edge” parameter to Serial Bursty Data Input timing

(0 ns). Updated same timing diagram to include Treqclk parameter.

JAN 2006

AddedThermal Data section (section 1.3)

APR 2006

Added Note 3 and Note 4 to Section 1.3, “Thermal Data” on page 7. Corrected

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