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PCF8811U/2DA/1 数据表(PDF) 6 Page - NXP Semiconductors |
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PCF8811U/2DA/1 数据表(HTML) 6 Page - NXP Semiconductors |
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6 / 81 page  PCF8811_4 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 04 — 27 June 2008 6 of 81 NXP Semiconductors PCF8811 80 x 128 pixels matrix LCD driver [1] Fabrication 1 identification starts with nnnnnn, where n represents a number between 0 and 9. [2] Fabrication 2 identification starts with AXnnnn, where X represents a letter and n represents a number between 0 and 9. [1] For the position of each pad, see Table 5. 6.2 Pin description Table 3. Bonding pad and chip dimensions Pad Row/Column side ( µm) Interface side ( µm) Pad pitch 51.84 min 54.0 min Pad size (aluminium) 42.84 × 105 50 × 100 Bump dimensions 29.9 × 98.5 (±3) 32.2 × 93.5 (±3) Wafer thickness (excluding bumps) 381 ( ±25) Fab 1 (mm)[1] Fab 2 (mm)[2] Die size X 12.45 12.41 Die size Y 2.31 2.27 Table 4. Alignment marker position[1] Pad X ( µm) Y ( µm) 2 5995 1017 108 −5904 1017 Table 5. Bonding pad description All x/y coordinates represent the position of the center of each pad with respect to the center (x/y = 0) of the chip; see Figure 2. Symbol Pad X ( µm) Y ( µm) Description - 1 6092.00 1030.00 dummy_slanted - 2 5995.00 1017.00 alignment mark - 3 5876.00 1030.00 dummy - 4 5822.00 1030.00 dummy - 5 5768.00 1030.00 dummy - 6 5714.00 1030.00 dummy - 7 5660.00 1030.00 dummy - 8 5390.00 1030.00 dummy MF2 9 5012.00 1030.00 manufacturer device ID input MF1 10 4850.00 1030.00 manufacturer device ID input MF0 11 4688.00 1030.00 manufacturer device ID input DS0 12 4526.00 1030.00 device recognition input OSC 13 4364.00 1030.00 oscillator input EXT 14 4094.00 1030.00 extended command set input PS0 15 3932.00 1030.00 parallel/serial/I2C-bus data selection input PS1 16 3770.00 1030.00 parallel/serial/I2C-bus data selection input PS2 17 3608.00 1030.00 parallel/serial/I2C-bus data selection input VSS(tie-off) 18 3446.00 1030.00 - |
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