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MSP430F2012IN 数据表(PDF) 34 Page - Texas Instruments |
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MSP430F2012IN 数据表(HTML) 34 Page - Texas Instruments |
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34 / 91 page ![]() MSP430F20x3 MSP430F20x2 MSP430F20x1 SLAS491G – AUGUST 2005 – REVISED APRIL 2011 www.ti.com Crystal Oscillator, XT1, Low-Frequency Mode (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT LFXT1 oscillator crystal fLFXT1,LF XTS = 0, LFXT1Sx = 0 or 1 1.8 V to 3.6 V 32768 Hz frequency, LF mode 0, 1 LFXT1 oscillator logic level fLFXT1,LF,logic square wave input frequency, XTS = 0, LFXT1Sx = 3 1.8 V to 3.6 V 10000 32768 50000 Hz LF mode XTS = 0, LFXT1Sx = 0, 500 fLFXT1,LF = 32768 Hz, CL,eff = 6 pF Oscillation allowance for OALF k Ω LF crystals XTS = 0, LFXT1Sx = 0, 200 fLFXT1,LF = 32768 Hz, CL,eff = 12 pF XTS = 0, XCAPx = 0 1 XTS = 0, XCAPx = 1 5.5 Integrated effective load CL,eff pF capacitance, LF mode(2) XTS = 0, XCAPx = 2 8.5 XTS = 0, XCAPx = 3 11 XTS = 0, Measured at P1.0/ACLK, Duty cycle, LF mode 2.2 V/3 V 30 50 70 % fLFXT1,LF = 32768 Hz Oscillator fault frequency, fFault,LF XTS = 0, LFXT1Sx = 3(4) 2.2 V/3 V 10 10000 Hz LF mode(3) (1) To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. (g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter. (2) Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. (3) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. (4) Measured with logic-level input frequency but also applies to operation with crystals. Internal Very-Low-Power Low-Frequency Oscillator (VLO) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TA VCC MIN TYP MAX UNIT -40 °C to 85°C 4 12 20 fVLO VLO frequency 2.2 V/3 V kHz 105 °C 22 I: -40 °C to 85°C dfVLO/dT VLO frequency temperature drift(1) 2.2 V/3 V 0.5 %/ °C T: -40 °C to 105°C dfVLO/dVCC VLO frequency supply voltage drift(2) 25 °C 1.8 V to 3.6 V 4 %/V (1) Calculated using the box method: I: (MAX(-40 to 85 °C) - MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C - (-40°C)) T: (MAX(-40 to 105 °C) - MIN(-40 to 105°C)) / MIN(-40 to 105°C) / (105°C - (-40°C)) (2) Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V) Timer_A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT Internal: SMCLK, ACLK 2.2 V 10 fTA Timer_A clock frequency External: TACLK, INCLK MHz 3 V 16 Duty cycle = 50% ± 10% tTA,cap Timer_A capture timing TA0, TA1 2.2 V/3 V 20 ns 34 Copyright © 2005–2011, Texas Instruments Incorporated |
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