AFS090 datasheet(164/334 Pages) MICROSEMI

部件名	AFS090

功能描述	Fusion Family of Mixed Signal FPGAs

PDF	334 Pages

Scroll/Zoom	100%

制造商	MICROSEMI [Microsemi Corporation]

网页	http://www.microsemi.com

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164 / 334 page

Device Architecture

2- 14 8

R e v isio n 2

Solution 3

The board-level design must ensure that the reflected waveform at the pad does not exceed limits

provided in Table 3-4 on page 3-4. This is a long-term reliability requirement.

This scheme will also work for a 3.3 V PCI/PCIX configuration, but the internal diode should not be used

for clamping, and the voltage must be limited by the bus switch, as shown in Figure 2-103. Relying on the

diode clamping would create an excessive pad DC voltage of 3.3 V + 0.7 V = 4 V.

Solution 4

Figure 2-103 • Solution 3

Figure 2-104 • Solution 4

Solution 3

Requires a bus switch on the board,

LVTTL/LVCMOS 3.3 V I/Os.

Fusion I/O Input

3.3 V

5.5 V

Bus

Switch

IDTQS32X23

On-Chip

Off-Chip

Solution 4

2.5 V On-Chip

Clamp

Diode

Requires one board resistor.

Available for LVCMOS 2.5 V / 5.0 V.

On-Chip

Off-Chip

5.5 V

2.5 V

Fusion I/O Input

Rext1

AFS090 数据表(PDF) 164 Page - Microsemi Corporation

AFS090 数据表(HTML) 164 Page - Microsemi Corporation

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